System and method for joining non-transparent parts by means...

Details System and method for joining non-transparent parts by means... System and method for joining non-transparent parts by means...

B - Operations, Transporting

32

B

B32B 37/26 (2006.01) C08J 5/12 (2006.01) C09J 5/00 (2006.01)

Patent

CA 2618327

Proposed is a system and a method for joining non-transparent parts (1, 2) by means of an electromagnetic radiation curable adhesive. The system comprises at least one at least partly transparent element (3) for inserting between the parts (1, 2) to be joined together such that electromagnetic radiation beamed into the element (3) initiates curing of a film of adhesive applied to the element (3) and/or to a non-transparent part (1, 2).

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