H - Electricity – 01 – C
Patent
H - Electricity
01
C
H01C 17/06 (2006.01) H05B 3/00 (2006.01)
Patent
CA 2693183
A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is formed on the dielectric layer, and a protective layer is formed over the resistive layer.
L'invention concerne un procédé de formation d'un dispositif résistif tel qu'une résistance de charge ou un chauffage. Le procédé consiste à former, par un seul cycle prédéterminé de pression, de température et de temps, une couche diélectrique qui définit une couche unique de bande diélectrique sur un substrat sur une cible ou sur une couche fonctionnelle adjacente ; puis à former une couche résistive sur la couche diélectrique et une couche protectrice sur la couche résistive.
Brummell Roger
Forbis Larry
Privett Angie
Gowling Lafleur Henderson Llp
Watlow Electric Manufacturing Company
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