A thin multichip module

Details A thin multichip module A thin multichip module

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/04 (2006.01) H01L 23/12 (2006.01) H01L 23/13 (2006.01) H01L 23/16 (2006.01) H01L 23/31 (2006.01) H01L 23/32 (2006.01) H01L 23/48 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H01L 23/58 (2006.01) H01L 25/065 (2006.01) H01L 25/10 (2006.01) H01R 4/04 (2006.01)

Patent

CA 2144740

An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in the molded frame (10). The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of the molded frame by a variety of configurations described herein. In one embodiment of the invention, the composite semiconductor substrate subassembly includes a composite substrate which comprises a thin metal cover plate and thin laminate circuit which is bonded to the metal cover plate by a film adhesive. The composite substrate provides a mounting surface for the placement of semiconductor devices and their associated passive components (58). In some of the embodiments disclosed herein, the composite semiconductor substrate subassembly, comprising a cover plate with the composite substrate attached thereto, is attached to the molded frame by a rectangular ring formed from an anisotropic, electrically conductive adhesive material (52). The composite substrate employed in the present invention offers the advantage of allowing the components to be pre-assembled, tested and repaired prior to final attachment into the molded frame.

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