Overvoltage protection device including wafer of varistor...

H - Electricity – 01 – C

Patent

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H01C 7/10 (2006.01) H01C 7/12 (2006.01)

Patent

CA 2341735

An overvoltage protection device includes a first electrode member having a first substantially planar contact surface and a second electrode member having a second substantially planar contact surface facing the first contact surface. A wafer formed of varistor material and having first and second opposed, substantially planar wafer surfaces is positioned between the first and second contact surfaces with the first and second wafer surfaces engaging the first and second contact surfaces, respectively. The contact surfaces may apply a load to the wafer surfaces. Preferably, the electrode members have a combined thermal mass which is substantially greater than a thermal mass of the wafer. The wafer may be formed by slicing a rod of varistor material. The device may include a housing including the first substantially planar contact surface and a sidewall, the housing defining a cavity within which the second electrode is disposed.

L'invention concerne un dispositif de protection contre les surtensions qui comprend une première électrode ayant une première surface de contact sensiblement plane et une seconde électrode ayant une seconde surface de contact sensiblement plane, laquelle fait face à la première surface de contact. Une plaquette en matériau du type varistance, qui comporte des première et seconde surfaces de plaquette opposées, sensiblement planes, est placée entre les première et seconde surfaces de contact, et les première et seconde surfaces de la plaquette s'engagent respectivement avec les première et seconde surfaces de contact. Les surfaces de contact peuvent appliquer une charge aux surfaces de la plaquette. De préférence, les électrodes présentent une masse thermique combinée sensiblement supérieure à celle de la plaquette, laquelle peut être formée par tranchage d'une tige de matériau du type varistance. Le dispositif peut comprendre un boîtier comprenant la première surface de contact et une paroi latérale, ce boîtier définissant une cavité dans laquelle on place la seconde électrode.

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