C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 5/02 (2006.01) B05D 3/00 (2006.01) B05D 3/10 (2006.01) B32B 3/30 (2006.01) B32B 7/12 (2006.01) B81C 3/00 (2006.01) H01L 21/302 (2006.01) H01L 21/306 (2006.01) H01L 21/308 (2006.01) H01L 21/58 (2006.01) H01L 23/14 (2006.01)
Patent
CA 2592266
A method of bonding a first substrate to a second substrate is provided. The method comprises the steps of: (a) providing a first substrate having a plurality of etched trenches defined in a first bonding surface; (b) providing a second substrate having a second bonding surface; and (c) bonding the first bonding surface and the second bonding surface together using an adhesive. During bonding, the adhesive is received, at least partially, in the plurality of etched trenches, thereby increasing the adhesive bond strength whilst avoiding surface roughening. The method is particularly suitable for bonding semiconductor chips using liquid adhesives.
L~invention porte sur le collage d~un premier substrat à un second. Le procédé comprend les étapes suivantes : (a) fournir un premier substrat ayant une pluralité de tranchées gravées définies dans une première surface de collage ; (b) fournir un second substrat ayant une seconde surface de collage ; et (c) coller, au moyen d~un adhésif, la première surface de collage à la seconde surface. Pendant le collage, l~adhésif est reçu, au moins en partie, dans la pluralité de tranchées gravées, augmentant ainsi la force de liaison adhésive tout en évitant une rugosité de surface. Le procédé est particulièrement adapté pour coller les puces à semi-conducteur qui utilisent des adhésifs liquides.
Oyen Wiggs Green & Mutala Llp
Silverbrook Research Pty Ltd
LandOfFree
Method of bonding substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of bonding substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding substrates will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1510121