Surface mount millimeter wave ic package

Details Surface mount millimeter wave ic package Surface mount millimeter wave ic package

H - Electricity

01

L

H01L 23/485 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01) H01L 23/66 (2006.01) H05K 1/02 (2006.01) H05K 3/46 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2308943

A packaged integrated circuit (10, 10a) which includes a multiple-layer interconnect (16, 16a) including a dielectric layer (32, 32a) disposed between a base layer (34, 34a) and a conductive transmission layer (36, 36a). The conductive layer (36, 36a) is electrically connectable to a substrate (11) and is electrically connected to an integrated circuit (18, 18a). The packaged integrated circuit (10, 10a) includes a base member (12, 12a) which engages the base layer (34, 34a) of the multiple-layer interconnect (16, 16a).

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