Arrangement of a semiconductor component suitable for...

Details Arrangement of a semiconductor component suitable for... Arrangement of a semiconductor component suitable for...

H - Electricity

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356/146, 356/9

H01L 23/48 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2008553

ABSTRACT OF THE DISCLOSURE A semiconductor component is provided in an arrangement suitable for surface mounting on a carrier plate. With the semiconductor arrangement, there is an exclusive holding of the terminal tapes by a semiconductor chip itself so that the previously-standard frame can be eliminated. In addition, the ductile terminal tapes are angled off by 90° relative to a principal face of the semiconductor chip so that a significantly smaller structure and a higher packing density are possible in comparison to previously known and standard TAB versions. For surface mounting of the semiconductor arrangement, the semiconductor chip is put in place on the carrier plate, as a result whereof the ductile terminal tapes deform and a reliable contacting to terminal areas on the carrier plate is guaranteed. The surface mounting is possible with additional SMD installations.

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