Accelerated sputtering system

Details Accelerated sputtering system Accelerated sputtering system

H - Electricity

05

K

356/12

H05K 3/10 (2006.01)

Patent

CA 2002192

ABSTRACT A process for coating a diagram on a substrate is disclosed, wherein a metal mask is applied to a prepared substrate and subjected to vacuum etching followed by vacuum sputtering. The sputter coating is accomplished at high vacuum using a plurality of spinning magnetrons to give an even deposition of metal on the substrate as well as an acceptable rate of deposition. After the desired thickness of metal is sputtered onto the substrate, the metal mask is stripped from the substrate and the product is finished using known techniques.

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