Thermosetting polyimide prepolymers ]

Details Thermosetting polyimide prepolymers ] Thermosetting polyimide prepolymers ]

C - Chemistry, Metallurgy

08

G

154/141, 402/219

C08G 73/10 (2006.01) C07D 207/452 (2006.01) C08G 73/12 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2008324

ABSTRACT OF THE DISCLOSURE In one embodiment this invention provides novel thermosetting aromatic polyimide prepolymers which have superior solubility and flow properties, and which can be thermally cured to heat and oxidation resistant thermoset adhesives, films, and molded products. Illustrative of a prepolymer is the dimaleimide of 2,2-bis[p,p'-(m-aminophenoxy)phenylsulfonyl(p-phenyleneoxy)- phenyl]propane.

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