Electromechanical switching device package with controlled...

H - Electricity – 01 – H

Patent

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Details

H01H 1/66 (2006.01) H01H 36/00 (2006.01) H01H 51/00 (2006.01) H01H 51/28 (2006.01) H05K 1/02 (2006.01) H05K 1/14 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2327108

A reed switch package (100) is disclosed that includes a reed switch (111) with at least one electrical signal path (106). A cylindrical ground shield (110) is provided about the reed switch (111). Ground terminals (108) are connected to opposing sides of the ground shield (110) so that the ground terminals (108) are on opposing sides of the signal terminal (106) and lie in the same plane. The reed switch (111) resides on a support substrate (222). An electrically conductive signal via (134) extends through the main body (212) and connects to the signal terminal (106). Ground vias (134) extend through the main body (212) and respectively connect to the ground terminals (108). The ground vias (134) are on opposing sides of the signal via (134) and lie in the same plane as the signal via (114). The signal and ground vias (134) exit at the bottom of the main body (212) and are connected to a circuit via solder balls (224) to provide a compact surface mount package with a controlled impedance environment.

Cette invention se rapporte à un boîtier de commutateur à lames (100), qui comprend un commutateur à lames (111) comportant au moins un trajet de signal électrique (106). Un blindage de terre cylindrique (110) est placé autour du commutateur à lame (111). Des bornes de terre (108) sont connectées aux côtés opposés du blindage de terre (110), pour que ces bornes de terre (108) soient placées sur les côtés opposés de la borne de signal (106) et se situent dans le même plan. Le commutateur à lames (111) repose sur un substrat de support (222). Un passage de signal électroconducteur (134) traverse le corps principal (212) et se connecte à la borne de signal (106). Des passages de terre (134) traversent le corps principal (212) et se connectent respectivement aux bornes de terre (108). Les passages de terre (134) sont placés sur les côtés opposés du passage de signal (134) et sont situés dans le même plan que le passage de signal (134). Les passages de signal et de terre (134) débouchent au bas du corps principal (212) et sont connectés à un circuit par des billes de soudure (224), afin de former un boîtier de montage en surface compact avec un milieu à impédance réglée.

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