Electrodeposition baths containing a mixture of...

Details Electrodeposition baths containing a mixture of... Electrodeposition baths containing a mixture of...

C - Chemistry, Metallurgy

25

D

C25D 13/10 (2006.01) A01N 47/44 (2006.01) A01N 59/14 (2006.01) A01P 1/00 (2006.01) C09D 5/44 (2006.01)

Patent

CA 2683718

Disclosed is an electrodeposition bath comprising a mixture of (i) at least one boron-containing compounds and (ii) chlorhexidine for controlling the growth of microorganisms in the electrodeposition bath. The combination of (i) and (ii) at a low concentration provides better control of microbes than does either (i) or (ii) at higher concentrations.

L'invention concerne un bain de dépôt électrolytique comprenant un mélange formé (i) d'au moins un composé contenant du bore et (ii) de chlorhexidine, destiné à stopper la croissance de microorganismes dans le bain de dépôt électrolytique. La combinaison de (i) et de (ii) en faible concentration permet une meilleure élimination des microbes que (i) ou (ii) en concentrations plus élevées.

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