Method of arranging signal and destination pads to provide...

H - Electricity – 05 – K

Patent

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H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/22 (2006.01)

Patent

CA 2283383

The invention provides an electronic circuit assembly having an arrangement of signal (21, 26) and destination (31, 36, 37) pads for two or more signals which provides multiple signal/destination connection combinations. One embodiment of the present invention comprises n signal pads (21, 26) and n destination pads (31, 36), where n is a number greater than one. The signal pads (21, 26) and destination pads (31, 36) are arranged on a substrate (50) in a polygonal array in an alternating signal pad/destination pad pattern. In a preferred embodiment, the polygonal array has the shape of a right polygon.

L'invention concerne un ensemble circuit électronique comportant un agencement de plots signal (21, 26) et destination (31, 36, 37) à plusieurs signaux qui donnent plusieurs combinaisons de connexions signal/destination. Une réalisation de l'invention comprend n plots signal (21, 26) et n plots destination (31, 36), n étant un nombre supérieur à un. Les plots signal (21, 26) et les plots destination (31, 36) sont disposés sur un substrat (50) en matrice polygonale à alternance plot signal/plot destination. Selon une réalisation préférée, l'ensemble polygonal a la forme d'un polygone orthogonal.

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