Electronic or optoelectronic housing with ceramic insert

G - Physics – 02 – B

Patent

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Details

G02B 6/42 (2006.01) H01L 23/057 (2006.01)

Patent

CA 2280937

The invention concerns a substantially parallelepiped-shaped housing for electronic or optoelectronic components designed to receive one or several means for routing electric transmission signals in the form of multilayer ceramic (14, 16) and/or optical (11) elements between the outer part and the electronic components arranged inside. The housing comprises a bottom (3) and a rectangular annular frame (2) constituting walls (4, 6, 7, 8, 27, 28). The housing frame (2) is made of metal, with a continuous periphery, and is bored with one or several slots (9, 12, 13) in a substantially intermediate position in one or several of said side walls (4, 6, 7), or one or several notches (24, 26) arranged in overlapping position on one or several said side walls and on the bottom (23), and extending over the whole length of one edge of the housing. The housing is produced by different manufacturing methods.

Un boîtier pour composants électroniques ou optoélectroniques, sensiblement parallélépipédique, est destiné à recevoir un ou plusieurs moyens d'acheminement de signaux de transmission électrique sous la forme d'éléments multicouches céramique (14, 16) et/ou optique (11) entre l'extérieur et les composants électroniques ou optoélectroniques disposés à l'intérieur. Le boîtier comprend un fond (3) et un cadre annulaire rectangle (2) constituant des parois (4, 6, 7, 8, 27, 28). Le cadre du boîtier (2) est métallique, avec un pourtour sans discontinuités, et est percé d'une ou plusieurs lumières (9, 12, 13) en position sensiblement médiane dans l'une ou plusieurs desdites parois latérales (4, 6, 7), ou une ou plusieurs entailles (24, 26), placées en position chevauchante sur l'une ou plusieurs desdites parois latérales et sur le fond (23), et s'étendant sur toute la longueur d'une arête du boîtier. Le boîtier est réalisé selon différents procédés de fabrication.

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