Thermally conductive mounting arrangement for securing an...

Details Thermally conductive mounting arrangement for securing an... Thermally conductive mounting arrangement for securing an...

H - Electricity

01

L

H01L 23/40 (2006.01) H01L 23/433 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2332939

An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficent force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.

Un montage électrique comprend un boîtier de microcircuit comportant une bride de fixation thermoconductrice qui se trouve en contact avec un dissipateur de chaleur. Un habillage thermoconducteur est fixé sur le dissipateur de chaleur, cet habillage entourant au moins partiellement le boîtier du microcircuit. Un élément de retenue résilient est placé entre l'habillage et le boîtier du microcircuit, cet élément de retenue appliquant une force suffisante sur le boîtier du microcircuit pour maintenir un bon contact thermique entre la bride de fixation et le dissipateur de chaleur.

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