H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/48 (2006.01) H01L 23/13 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2416502
The invention concerns a method for making an integrated circuit (40) capable of being surface-mounted which consists in first making a housing with a rear face and an array of connection pins extending underneath said rear surface perpendicular thereto, and then in forming at the end of each pin a ball (44) of alloy with low melting point enclosing said end and welded thereto. The invention also concerns an integrated circuit (40) capable of being surface-mounted, comprising a housing with a rear surface and an array of connection pins, with substantially constant cross-section along the pin, extending underneath said rear surface perpendicular thereto. A ball (44) of alloy with low melting point is welded to the end of each pin (42) enclosing said end. The invention is applicable to surface-mounted integrated circuits.
L'invention concerne un procédé de fabrication d'un circuit intégré (40) de type montable en surface comprenant d'abord la fabrication d'un boîtier ayant une face arrière et un réseau de broches de connexion s'étendant sous cette face arrière perpendiculairement à celle-ci, et l'on forme ensuite à l'extrémité de chaque broche une bille (44) d'alliage à bas point de fusion entourant cette extrémité et soudée à celle-ci. L'invention concerne aussi un circuit intégré (40) de type montable en surface, comportant un boîtier ayant une face arrière et un réseau de broches de connexion, de section sensiblement constante le long de la broche (42), s'étendant sous la face arrière perpendiculairement à celle-ci. Une bille d'alliage (44) à bas point de fusion est soudée à l'extrémité de chaque broche (42) en entourant cette extrémité. Applications: circuits intégrés pour montage en surface.
Atmel Grenoble
Robic
LandOfFree
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