Patterning process and product

Details Patterning process and product Patterning process and product

H - Electricity

05

K

356/12

H05K 3/06 (2006.01) C23C 14/04 (2006.01) C23F 1/02 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2002736

Abstract of the Disclosure A method of providing patterned, thin-film materials on flexible substrates by depositing a first, etchable, integral mask onto a substrate, depositing a second pattern material over the mask region and then removing the mask, such as by etching. Patterned films useful as printed circuits and the like can be prepared by this method. In an alternate embodiment, patterned particles can be prepared for dispersion in a vehicle or matrix using the described process.

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