Circuit pack with inboard jet cooling

Details Circuit pack with inboard jet cooling Circuit pack with inboard jet cooling

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2039058

- 7 - CIRCUIT PACK WITH INBOARD JET COOLING Abstract Disclosed is a means for cooling heat generating components mounted on the front surface of printed circuit boards. A conduit member is attached to the back surface of the board to form a sealed plenum and to provide direction of cooling fluid toward the components. Holes in the board establish cooling jets directed at the components from the plenum.

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