High modulus silicones as toughening agents for epoxy resins

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 63/00 (2006.01) B32B 27/38 (2006.01) C08L 83/08 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2049180

This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.

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