G - Physics – 02 – F
Patent
G - Physics
02
F
G02F 1/01 (2006.01) B81B 7/02 (2006.01) G02B 26/00 (2006.01) G02F 1/13 (2006.01) G09F 9/30 (2006.01)
Patent
CA 2516912
A package structure 210 and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator 400 is formed on a transparent substrate 250. A backplane 310 is joined to the transparent substrate to form a package structure 210 and to encapsulate the interferometric modulator. A desiccant 500 integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.
Idc Llc
Smart & Biggar
LandOfFree
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