Thermoplastic resin composition

Details Thermoplastic resin composition Thermoplastic resin composition

C - Chemistry, Metallurgy

08

L

C08L 101/00 (2006.01) C08K 3/00 (2006.01) C08K 3/04 (2006.01) C08L 23/02 (2006.01) C08L 23/04 (2006.01) C08L 31/02 (2006.01) H01B 1/24 (2006.01)

Patent

CA 2061644

ABSTRACT Disclosed in this invention is a thermoplastic resin composition comprising a thermoplastic resin, a conductive inorganic filler and/or a non-conductive inorganic filler, and an adduct of an ethylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a saturated carboxylic acid. The adduct of an alkylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a carboxylic acid is an additive having excellent compatibility with the thermoplastic resin and useful for improving dispersibility of the inorganic filler.

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