Method and apparatus for thixotropic molding of semisolid...

B - Operations – Transporting – 22 – D

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B22D 23/06 (2006.01) B22D 17/00 (2006.01)

Patent

CA 2453397

A method and apparatus for thixotropic molding of semisolid alloys are disclosed. The method comprises of feeding a dendritic-free feedstock bar into an extruder barrel, melting a terminal portion of the feedstock bar into a semisolid slurry by heating it to a temperature between its solidus and liquidus temperatures, and using the solid portion of the feedstock bar as an one-time "plunger" to inject the semisolid slurry into a mold cavity. The apparatus based on the present method, which is equipped without a regular extruder screw or plunger, uses a feedstock bar as a one-time plunger to inject semisolid slurries formed from a terminal portion of the same feedstock bar.

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