Thermosetting mixtures utilizing araliphatic sulfonium salts

Details Thermosetting mixtures utilizing araliphatic sulfonium salts Thermosetting mixtures utilizing araliphatic sulfonium salts

C - Chemistry, Metallurgy

08

G

402/137

C08G 18/06 (2006.01) C08G 18/00 (2006.01) C08G 18/22 (2006.01) C08G 18/40 (2006.01) C08G 18/42 (2006.01) C08G 18/48 (2006.01) C08G 59/40 (2006.01) C08G 59/68 (2006.01)

Patent

CA 2027768

Thermosetting mixtures containing (a) an epoxy resin having on average more than one 1,2-epoxide group in the molecule, (b) a di- or polyisocyanate compound and (c) a sulfonium salt of the formulae I to IV Image in which A is C1-C12alkyl, C3-C8cycloalkyl, C4-C10cycloalkylalkyl or phenyl which is unsubstituted or substituted by one or more substituents from the group comprising C1-C8alkyl, C1-C4alkoxy, halogen, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 C atoms in the alkoxy radical or acyl having 1-12 C atoms, Ar, Ar1 and Ar2 independently of one another are each phenyl which is unsubstituted or substituted by one or more substituents from the group comprising C1-C8alkyl, C1-C4alkoxy, halogen, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 C atoms in the alkoxy radical and acyl having 1-12 C atoms, or are naphthyl which is unsubstituted or substituted by one or more substituents from the group comprising C1-C8alkyl, C1-8alkoxy, halogen, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 C atoms in the alkoxy radical and aryl having 1-12 C atoms, arylene in each case is phenylene which is unsubstituted or substituted by one or more substituents from the group comprising C1-C8alkyl, C1-C4alkoxy, halogen, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 C atoms in the alkoxy radical and acyl having 1-12 C atoms, or is naphthylene which is unsubstituted or substituted by one or more substituents from the group comprising C1-C8alkyl, C1-C4alkoxy, halogen, nitro, phenyl, phenoxy, alkoxycarbonyl having 1-4 C atoms in the alkoxy radical and acyl having 1-12 C atoms, and Q~ is SbF6~, AsF6~ or SbF5OH~, give moulded materials of high crosslinking density and thus high heat resistance on thermal curing.

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