Method for applying a conductive trace pattern to a substrate

Details Method for applying a conductive trace pattern to a substrate Method for applying a conductive trace pattern to a substrate

B - Operations, Transporting

05

D

356/6, 117/66

B05D 1/36 (2006.01) B05D 5/12 (2006.01) H05K 3/04 (2006.01) H05K 3/10 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2014793

ABSTRACT A fabrication method for applying electrically conductive circuit traces to a substrate is described. The method uses an ink composition which is applied to a selected substrate by an ink jet delivery system. The ink includes an adhesive in combination with other additives, including one or more solvents. The ink is delivered by the ink jet system in a selected pattern, followed by the application of a powdered metal to the pattern which adheres to the adhesive in the ink. After the removal of excess powder, the substrate, pattern and powder are heated in an amount sufficient to melt the powder on the substrate. This produces a pattern of conductive traces geometrically corresponding to the ink pattern initially applied to the substrate.

Affiliated with

Also associated with

Rating

Method for applying a conductive trace pattern to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying a conductive trace pattern to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying a conductive trace pattern to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1583177