C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/06 (2006.01) C08L 77/00 (2006.01) C08L 77/02 (2006.01)
Patent
CA 2132312
Thermoplastic polymeric compositions which feature good physical properties which are relatively insensitive to humidity and further exhibit good barrier properties of the compositions comprise: (A) a first conventional polyamide, and (B) an amorphous copolyamide which is polymerized from (B1) a polyamide forming monomer selected from the group consisting of lactams, aminoalkanoic acids and mixture thereof wherein the monomer is present in a molar proportion of between about 0 and 50 % (B2) a diamine selected from the group consisting of aralkylene diamines, cycloalkylene diamines and mixtures thereof, the diamine being present in a molar proportion of between about 25 and 60 %, (B3) a dicarboxylic acid selected from the group of an aromatic dicarboxylic acid; aralkylene dicarboxylic acids, and aliphatic dicarboxylic acids; preferably the use of an aliphatic dicarboxylic acid in conjunction with an aromatic dicarboxylic acid is preferred, at least one aromatic diacid, the dicarboxylic acid being present in a molar proportion of between about 25 and 60 %, wherein the (A) and (B) are substantially miscible when formed into a blend composition. The blend composition finds use as a molding composition, as well as a film forming composition, alternatively, may be formed into a variety of articles which exhibit improved physical properties.
Akkapeddi Murali Krishna
Glans Jeffrey Harper
Parmer Jerome Forest
Allied-Signal Inc.
Basf Aktiengesellschaft
Gowling Lafleur Henderson Llp
LandOfFree
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