Semiconductor device

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H - Electricity

01

L

H01L 23/14 (2006.01) H01L 21/68 (2006.01) H01L 23/544 (2006.01) H05K 13/04 (2006.01)

Patent

CA 2096551

ABSTRACT OF THE DISCLOSURE A semiconductor device having a high packaging yield is disclosed. A light directed to a light reflection area (20) formed on a packaging substrate (10) is reflected with an accurate angle. A light directed to a second light reflection area (50) formed on a semiconductor chip (40) is also reflected with an accurate angle. A relative inclination between the packaging substrate (10) and the semiconductor chip (40) is measured based on the reflection angles of the reflected lights.

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