Integrated circuit packaging

Details Integrated circuit packaging Integrated circuit packaging

H - Electricity

01

L

H01L 23/08 (2006.01) H01L 23/552 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2092371

A package is provided for an integrated circuit comprising a dielectric body enclosing the integrated circuit chip having a plurality of conductive terminal members extend through the dielectric body. The dielectric body includes a magnetic shielding layer for electromagnetic radiation from the integrated circuit. The magnetic shielding layer comprises a material having a high magnetic permeability and a high resistivity, so that the dielectric body absorbs electromagnetic radiation at frequencies generated by the integrated circuit and thereby attenuates electromagnetic emissions from the integrated circuit. Suitable materials having a high dielectric constant and high magnetic permeability include ferrites. Conveniently a shielding layer of ferrimagnetic material comprising a ferrite plate may be applied to surfaces of a conventional plastic or ceramic packaging material. Alternatively, ferrite particles may be incorporated into binder to form a composite material suitable for forming into an IC package. The magnetic nature of the shielding provides that a non-conductive dielectric package may significantly attenuate and suppress electromagnetic interference generated by an enclosed IC. Further to provide effective electromagnetic shielding for a large apparatus, individual packages may be customised to provided shielding to particular integrated circuit chips with higher emissions, thereby reducing the total cost of shielding an electronic system or apparatus.

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