Array of electrical components with leads attached

H - Electricity – 01 – R

Patent

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Details

H01R 4/02 (2006.01) H01L 23/495 (2006.01) H01R 43/20 (2006.01) H05K 13/00 (2006.01) H01R 43/02 (2006.01)

Patent

CA 2210975

A method of making an array of electrical components having pre-attached leads ready for automated surface-mounting on a substrate. The method involves aligning an array of leads (10) with electrical components and attaching each lead to a conductive terminal on a respective component. A series or coil (52) of leads joined integrally together and carried by a carrier strip (14) is thus provided with a series of electrical components (24) pre-attached thereto. The electrical components along with their leads may thus be quickly and easily surface-connected to the conductive pads on a substrate (70) in a simple, automated manner.

Procédé de fabrication de composants électriques à conducteurs connectés préalablement prêts pour un montage automatique en surface sur un substrat. Le procédé consiste à aligner une rangée de conducteurs (10) avec des composants électriques et à connecter chaque conducteur à une borne conductrice de chaque composant. On obtient ainsi une série ou une bobine (52) de conducteurs entièrement reliés entre eux et soutenus par une bande porteuse (14), auxquels aura été connectée préalablement une série de composants électriques (24). Les composants électriques et leurs conducteurs peuvent ainsi être rapidement et aisément connectés en surface aux blocs conducteurs sur un substrat (70) à l'aide d'un procédé simple et automatique.

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