Semiconductor substrate assemblies and methods for preparing...

Details Semiconductor substrate assemblies and methods for preparing... Semiconductor substrate assemblies and methods for preparing...

H - Electricity

01

L

H01L 21/78 (2006.01) B23K 26/40 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2546632

A method for forming semiconductor devices using a semiconductor substrate having first and second opposed surfaces and including first and second device regions includes directing a beam of laser light at the substrate such that the beam of laser light is focused within the substrate between the first and second surfaces thereof and the beam of laser light forms a thermally weakened zone (TWZ) in the substrate. The TWZ extends between the first and second device regions and defines a break line.

L'invention concerne un procédé de formation de dispositifs à semi-conducteurs au moyen d'un substrat à semi-conducteurs qui comprend une première et une deuxième surface opposées, lesdits dispositifs comprenant une première et une deuxième région. Ce procédé consiste à diriger un faisceau laser sur le substrat de façon que le faisceau laser soit focalisé à l'intérieur du substrat entre sa première et sa deuxième surface, et qu'il forme une zone thermiquement affaiblie (TWZ) dans le substrat. La zone thermiquement affaiblie s'étend entre les première et deuxième régions de dispositif et définit une ligne de rupture.

Affiliated with

Also associated with

Rating

Semiconductor substrate assemblies and methods for preparing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor substrate assemblies and methods for preparing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor substrate assemblies and methods for preparing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1597369