Method of making microwave, multifunction modules using...

Details Method of making microwave, multifunction modules using... Method of making microwave, multifunction modules using...

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01) H01L 23/66 (2006.01) H05K 1/03 (2006.01) H05K 1/16 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2320064

A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates (1-10) into a multilayer structure (200) using fusion bonding. The bonded multilayers (1-10), with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module (200). Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Une plate-forme permet de fabriquer des circuits intégrés multicouche hyperfréquence et des modules multi-fonctions hyperfréquence. Le procédé de fabrication consiste à assembler des substrats composites de fluoropolymères (1-10) dans une structure (200) multicouche par assemblage par fusion. Les multicouches (1-10) assemblées, présentant des semiconducteurs encastrés, des résistances gravées, des motifs de circuits, et des trous de passage plaqués, forment un module (200) de montage en surface monobloc. On peut recourir à l'assemblage par film ou à l'assemblage par fusion pour recouvrir des semiconducteurs encastrés, d'une ou de plusieurs couches.

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