Process for producing semiconductor article

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01L 21/20 (2006.01) H01L 21/265 (2006.01) H01L 21/304 (2006.01) H01L 21/322 (2006.01) H01L 21/762 (2006.01)

Patent

CA 2221100

A novel process for producing a semiconductor article is disclosed which comprises steps of preparing a first substrate constituted of a silicon substrate, a nonporous semiconductor layer formed on the silicon substrate, and an ion implantation layer formed in at least one of the silicon substrate and the nonporous semiconductor layer; bonding the first substrate to a second substrate to obtain a multiple layer structure with the nonporous semiconductor layer placed inside; separating the multiple layer structure at the ion implantation layer; and removing the ion implantation layer remaining on the separated second substrate.

Nouveau procédé pour la fabrication d'un article semi-conducteur comportant les étapes suivantes : préparation d'un premier substrat composé de silicone, d'une couche semiconductrice non poreuse formée à la surface du substrat en silicone, formation d'une couche d'implantation ionique sur le substrat ou sur la couche non poreuse; liaisonnement du premier substrat au second substrat pour l'obtention d'une structure multicouches avec la couche non poreuse à l'intérieur; séparation de la structure multicouches au niveau de la couche d'implantation ionique, et enlèvement de la couche d'implantation ionique restée sur le deuxième substrat.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Process for producing semiconductor article does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for producing semiconductor article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for producing semiconductor article will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1607219

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.