G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 1/14 (2006.01) H01L 21/027 (2006.01)
Patent
CA 2274972
A method of manufacturing a pellicle, in which a thin film which is one of the components of a pellicle to serve as a dust-proof cover of a mask used for patterning in the manufacture of a semiconductor device or a liquid crystal display panel is temporarily formed on a frame larger than a specific frame which is another component of the pellicle, adhesive is applied to the specific frame beforehand and the larger frame is put on the specific frame with adhesive to bond the thin film which is applied temporarily to the larger frame to the specific frame. The thin film which is applied to the larger frame is transferred to the specific frame and parts of the thin film which protrude from the specific frame are cut off with a physical cutting means to obtain a pellicle. Immediately after, or simultaneously when, or before the parts of the thin film are cut off with the physical cutting means, coating material which is obtained by dissolving a specific resin in organic solvent is applied to the parts of the thin film which are to be cut off with the physical cutting means.
L'invention a trait à un procédé de production de pellicule selon lequel on forme, provisoirement, un film mince qui est l'un des constituants d'une pellicule devant servir de revêtement, à l'épreuve de la poussière, de masque utilisé pour configurer un dispositif à semi-conducteurs ou un panneau d'affichage à cristaux liquides, sur un cadre aux dimensions supérieures à celles d'un cadre spécifique, lequel cadre est un autre constituant de la pellicule. On applique, au préalable, un adhésif sur le cadre spécifique et l'on pose le plus grand cadre sur celui-ci avec un adhésif afin de fixer le film mince appliqué provisoirement sur ledit grand cadre. On transfère alors ce film mince sur le cadre spécifique et l'on coupe, à l'aide d'instruments coupants, les parties de ce film dépassant du cadre spécifique afin d'obtenir une pellicule. Immédiatement après avoir coupé les parties susmentionnées, si ce n'est en même temps ou encore avant, on applique un enduit, obtenu par dissolution d'une résine spécifique dans un solvant organique, sur les parties à couper du film mince.
Fujita Minoru
Kondou Masahiro
Kurata Hiroyuki
Nakagawa Hiroaki
Mitsui Chemicals Inc.
Smart & Biggar
LandOfFree
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