Burst-ultrafast laser machining method

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B23K 26/00 (2006.01) A61F 9/01 (2006.01) B23K 26/06 (2006.01) B23K 26/36 (2006.01) B23K 26/38 (2006.01) B23K 26/40 (2006.01) C03B 29/02 (2006.01) C03B 33/08 (2006.01) C03C 23/00 (2006.01) A61B 17/00 (2006.01)

Patent

CA 2296924

A method of laser processing of materials. The combination of ultrafast laser pulses and high-repetition rate (>1MHz) bursts (or continuous operation) defines a new regime for material processing. The high rate controls thermal processes evolving between each ultrafast laser pulse that 'prepares' the sample surface or bulk for optimal interaction with subsequent ultrafast laser pulses. The addition of this laser-controlled thermal component overcomes several current limitations of ultrafast laser processing at lower repetition rates (< 1MHz), providing means to fully harness the many attributes by ultrafast lasers for material processing applications.

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