Air cooled heat exchanger for multi-chip assemblies

Details Air cooled heat exchanger for multi-chip assemblies Air cooled heat exchanger for multi-chip assemblies

H - Electricity

01

L

H01L 23/427 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2046009

ABSTRACT OF THE DISCLOSURE In an air-cooled self-contained evaporator and condenser apparatus with no external power source for cooling a multichip unit,the apparatus includes a cold plate having a first surface with recesses formed therein (which recesses might have aluminum nitride slugs for heat transfer) in a matrix or array corresponding to the matrix or array of chips on a multi-chip module or unit. The opposite surface of the cold plate includes a finned arrangement which, in conjunction with the cold plate, forms part of an isolated evaporation chamber of the cooling unit with the chamber housing a boilable fluid which changes phase from liquid to vapor. Positioned above and contiguous with the isolated chamber is a condensing chamber, including a plurality of finned tubular passageways. Heat is transferred from the chips through the slugs, through the cold plate to cause boiling of the fluid within the chamber, the vapors of which are condensed in the upper part of the cooling unit to thus return as fluid to the chamber.

Affiliated with

Also associated with

Rating

Air cooled heat exchanger for multi-chip assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Air cooled heat exchanger for multi-chip assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Air cooled heat exchanger for multi-chip assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1619128