Spiral couplers

H - Electricity – 01 – P

Patent

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Details

H01P 5/18 (2006.01)

Patent

CA 2480457

A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers (140, 150, 160, 170) having metal layers (110, 120, 130) disposed thereon are bonded to form the package. A plurality of ground planes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

L'invention concerne un circuit micro-onde, qui met en oeuvre une configuration de coupleur hélicoïdal pour obtenir la fonctionnalité d'un coupleur classique avec une densité supérieure et un volume inférieur. Plusieurs couches de base accueillant des couches métalliques sont contrecollées de manière à former l'ensemble. Plusieurs plans de masse peuvent être utilisés pour isoler la forme en spirale de lignes qui sortent pour venir au contact de plots ou d'autres circuits.

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