Method of filling a well in a substrate

B - Operations – Transporting – 01 – L

Patent

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Details

B01L 99/00 (2010.01) B01L 3/00 (2006.01) B01L 3/14 (2006.01)

Patent

CA 2466513

The invention relates to a method of filling a well (including a channel) in a substrate. In accordance with the invention liquid is applied on a substrate comprising a well on a position that does not coincide with the well, and the well after filling is sealed with a cover means, wherein liquid is applied on a position between the front of the cover means and the well that is not covered by the cover means, and with the aid of the cover means the liquid is pushed into the well.

La présente invention concerne un procédé de remplissage d'un puits ( y compris un canal) dans un substrat. Selon cette invention, on applique un liquide sur un substrat comprenant un puits, à une position qui ne coïncide pas avec ce puits, et ce puits est scellé après remplissage avec un organe de recouvrement. On applique le liquide à une position située entre l'avant de l'organe de recouvrement et le puits, lequel n'est pas encore recouvert de cet organe de recouvrement, et ce liquide est poussé dans le puits au moyen de l'organe de recouvrement.

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