Solder delivery system

Details Solder delivery system Solder delivery system

B - Operations, Transporting

23

K

113/80

B23K 3/06 (2006.01) B23K 35/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2039192

Abstract of the Disclosure A solder delivery system including a carrier of compliant, dimensionally passive, high-temperature material, the carrier remaining generally dimensionally passive during heating and having a detent therein including fusible material, preferably in the form of a solder paste, positioned therein which is plastically deformable and adhesive-like, the carrier and fusible material together being compliant to conform to objects to be soldered before heating of the system.

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