Multi-level assembly of electronic modules

Details Multi-level assembly of electronic modules Multi-level assembly of electronic modules

H - Electricity

05

K

H05K 7/00 (2006.01) H01L 23/31 (2006.01) H01L 25/065 (2006.01) H01L 25/10 (2006.01)

Patent

CA 2219831

The invention provides for an assembly of numerous electronic modules on a support structure. The assembly is characterized by the fact that each of the said electronic modules is in the form of electronic components stacked on at least two levels and separated by an intermediate layer, the said electronic modules each comprising a hole formed in an intermediate layer, and the said support structure comprises at least one rod that is introduced into the respective holes of the successive modules.

L'invention fournit un assemblage de modules électroniques comprenant une pluralité de modules électroniques supportés par une structure porteuse. L'assemblage est caractérisé en ce que chacun desdits modules électroniques est sous la forme de composants électroniques empilés sur au moins deux niveaux qui sont séparés entre eux par une couche intermédiaire, lesdits modules électroniques comprennent chacun un trou formé dans une couche intermédiaire, et ladite structure porteuse comprend au moins un élément de tige qui est introduit dans des trous respectifs de modules successifs.

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