Method, system and composition for soldering by induction...

B - Operations – Transporting – 23 – K

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327/18, 75/1.2

B23K 1/00 (2006.01) B23K 35/24 (2006.01) B29C 65/36 (2006.01) H05B 6/00 (2006.01) H05B 6/02 (2006.01) H05B 6/10 (2006.01) B23K 35/02 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2034209

This invention provides a method for soldering using induction heating, which is accomplished by the use of lossy heating particles in or on the solder and an alternating magnetic field. The lossy heating particles useful in this invention are magnetic particles, which can be ferromagnetic particles or ferrimagnetic particles, preferably ferrites, which have a Curie temperature at least equal to the flow temperature of the solder. These particles thereby provide a self-regulation feature which prevents overheating of the solder in the articles being soldered. The invention also discloses the use of particles with surface properties whereby the particles can either be wetted by the solder and remain in the solder when the solder flows or it can be nonwettable by the solder whereby the particles separate from the solder when the solder flows. This invention also discloses solder compositions, systems and assemblies utilizing the above combinations of solder and lossy heating particles.

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