Process for electroplating metallic and metall matrix...

C - Chemistry – Metallurgy – 25 – D

Patent

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C25D 5/18 (2006.01)

Patent

CA 2490464

The invention relates to a process for forming coatings or free-standing deposits of nano-crystalline metals, metal alloys or metal matrix composites. The process employs drum plating or selective plating processes involving pulse electrode-position and a non-stationary anode or cathode. Novel nano- crystalline metal matrix composites and micro components are disclosed as well. Also described is a process for forming micro-components with grain sizes below 1,000nm.

L'invention concerne un procédé de formation de revêtements ou de dépôts autonomes de métaux nanocristallins, d'alliages métalliques ou de composites à matrice métallique. Ce procédé utilise un dépôt au tambour ou des processus de placage sélectif mettant en oeuvre une position d'électrode par impulsion avec une anode ou une cathode non stationnaire. L'invention concerne aussi des composites et de microcomposants à matrice métallique. Elle concerne enfin un procédé de formation de microcomposants dont la granulométrie est inférieure à 1000 nm.

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