Thermoplastic resin composition

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

400/1811, 400/30

C08L 93/00 (2006.01) C08L 51/06 (2006.01) C08L 71/12 (2006.01) C08L 59/00 (2006.01) C08L 61/06 (2006.01) C08L 67/00 (2006.01) C08L 69/00 (2006.01) C08L 77/00 (2006.01) C08L 81/02 (2006.01) C08L 81/06 (2006.01) C08L 83/00 (2006.01)

Patent

CA 2002910

ABSTRACT OF THE DISCLOSURE Disclosed herein is a thermoplastic resin composition which comprises: (a) polyphenylene ether or a composition containing poly- phenylene ether, (b) (i) a modified propylene polymer grafted with a styrene-based monomer or a mixture of a styrene-based monomer and a monomer copolymerizable with the styrene-based monomer, or (ii) a composition contain- ing said modified propylene polymer and a propylene polymer, (c) a rubbery substance, and at least one component selected from the following three components; . (d) a styrene resin having a melt index of 8 or above (at 250°C under a load of 5 kg), (e) a low-molecular weight hydrocarbon resin, and (f) white oil and/or liquid paraffin. This thermoplastic resin composition exhibits not only good moldability but also well-balanced physical properties and heat resistance, and can be easily pro- cessed into molded articles having outstanding physical properties.

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