Sensor for thermal analysis and systems including same

G - Physics – 01 – N

Patent

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Details

G01N 25/00 (2006.01) G01D 11/00 (2006.01) G01N 5/00 (2006.01) G01N 25/20 (2006.01)

Patent

CA 2679770

Certain embodiments disclosed herein are directed to a sensor comprising a support member, a sample sensor coupled to the support member and comprising a sample support electrically coupled to a first set of interconnects, and a reference sensor coupled to the support member and comprising a ring coupled to a second set of interconnects, in which the ring is positioned adjacent to and surrounding at least a portion of the sample support of the sample sensor.

L'invention concerne un capteur comprenant un élément de support, un capteur d'échantillon couplé à l'élément de support et comprenant un support d'échantillon électriquement couplé à un premier ensemble d'interconnexions, et un capteur de référence couplé à l'élément de support et comprenant une bague couplée à un second ensemble d'interconnexions, dans lequel la bague est positionnée près et autour d'au moins une partie du support d'échantillon du capteur d'échantillon.

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