Polyimide resins useful at high temperatures

C - Chemistry – Metallurgy – 07 – D

Patent

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Details

C07D 209/48 (2006.01) C07D 405/14 (2006.01) C08G 73/10 (2006.01) C08G 73/12 (2006.01)

Patent

CA 2106062

Polyimide resins useful at high temperatures are prepared from: (a) a dialkyl, trialkyl or tetraalkylester of biphenyltetracar- boxylic acid; (b) phenylenediamine, preferably the phenylenediamine comprses a mixture of meta- and para-phenylenediamine; and (c) a divalent end cap compound that is capab;e of undergoing addition polymerization.

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