Micromachining methods and systems

Details Micromachining methods and systems Micromachining methods and systems

B - Operations, Transporting

24

B

B24B 19/00 (2006.01) B41J 2/16 (2006.01)

Patent

CA 2503918

A method of forming fluid handling slots in a semiconductor substrate having a thickness defined by a first side and a second side is provided. The method comprises ultrasonic grinding, utilizing an abrasive material, into the semiconductor substrate from a first side to form a first trench, and removing semiconductor substrate material from the backside to form a second trench, wherein at least a portion of the first and second trenches intersect to form a feature through the semiconductor substrate.

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