Device for testing adhesive bonds

Details Device for testing adhesive bonds Device for testing adhesive bonds

G - Physics

01

N

73/85

G01N 3/00 (2006.01) B29C 65/00 (2006.01) B29C 65/18 (2006.01) B29C 65/82 (2006.01) G01N 19/04 (2006.01) B29C 65/48 (2006.01)

Patent

CA 2028965

DEVICE FOR TESTING ADHESIVE BONDS ABSTRACT OF THE DISCLOSURE The device permits duplicating any of a plurality of process variables, such as, temperature, cure time and pressure that affect the development of adhesive bonding strength. The device provides data that is indicative of the adhesive bonding strength for any selected combination for these process variables.

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