Method for the production of contacts of electrical...

Details Method for the production of contacts of electrical... Method for the production of contacts of electrical...

H - Electricity

01

L

H01L 21/56 (2006.01) H01L 21/60 (2006.01) H01L 23/31 (2006.01) H03H 3/08 (2006.01) H03H 9/05 (2006.01)

Patent

CA 2241037

In a process for producing contacts on SW components suitable for a flip-chip assembly, in which electrically conductive structures (3) on a substrate (1) are encapsulated by a cover (2), after the cover (2) has been produced, solderable layers (4) in contact with pads of the electrically conductive structures (3) are applied.

L'invention concerne un procédé de production de contacts de composants à ondes de surface, convenant au montage par bosses soudées. Des structures électroconductrices (3) prévues sur un substrat (1) sont encapsulées par un élément de protection (2). Une fois cette protection (2) réalisée, des couches (4) brasables mises en contact avec des plages de connexion des structures électroconductrices (3) sont appliquées.

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