Photosensitive resin composition and method of use thereof

Details Photosensitive resin composition and method of use thereof Photosensitive resin composition and method of use thereof

G - Physics

03

F

96/177

G03F 7/038 (2006.01) G03F 7/028 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2032329

ABSTRACT A one-component epoxy containing photosensitive composition and a method of using that composition is disclosed . The composition is aqueous developable and suitable for use as a solder, etch or plate resist in the manufacture of printed circuit boards. The composition also shows good storage stability properties and can be processed under standard exposure and development processes. The photosensitive composition primarily contains (a) at least one compound having one or more carboxyl groups, (b) at least one compound having two or more ethylenically unsaturated functionalities and (c) at least one compound having two or more epoxyl groups.

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