Sealant composition having reduced permeability to gas

Details Sealant composition having reduced permeability to gas Sealant composition having reduced permeability to gas

C - Chemistry, Metallurgy

08

L

C08L 75/04 (2006.01) C08K 7/00 (2006.01) C08L 101/00 (2006.01) C09D 175/04 (2006.01) C09J 175/04 (2006.01)

Patent

CA 2640238

This invention relates to a moisture-curable silylated resin-containing composition containing, inter alia, moisture-curable silylated resin and organic nanoclay(s), the cured composition exhibiting low permeability to gas(es).

L'invention concerne une composition contenant une résine silylée durcissable à l'humidité, qui renferme, notamment, une résine silylée durcissable à l'humidité et une ou plusieurs nanoargiles organiques, la composition durcie présentant une faible perméabilité aux gaz.

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