Epoxy adhesive compositions with high mechanical strength...

C - Chemistry – Metallurgy – 08 – L

Patent

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C08L 63/00 (2006.01) C09J 163/00 (2006.01)

Patent

CA 2753569

A heat-curable adhesive composition comprising an epoxy-resin, a combination of core-shell toughening agents, a first curing agent being a linear aliphatic amined and a second curing agent being a cyclic aliphatic amine and a filler wherein the composition can be cured to form structural adhesives of high mechanical strength over a temperature range from -55°C to up to 135°C.

Cette invention concerne une composition adhésive thermodurcissable comprenant une résine époxy, une combinaison d'agents de durcissage à cur-coque, un premier agent de durcissage étant une amine aliphatique linéaire et un second agent de durcissage étant une amine aliphatique cyclique, et une charge. La composition peut être durcie pour former des adhésifs structuraux dotés d'une résistance mécanique élevée sur une plage de températures de -55°C à 135°C.

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