Plastic package, semiconductor device, and method of...

Details Plastic package, semiconductor device, and method of... Plastic package, semiconductor device, and method of...

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 23/00 (2006.01) H01L 23/10 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2232843

Disclosed is a plastic package for storing a chip, the plastic package being further improved in moisture resistance and reduced in manufacturing costs. The plastic package comprises a plastic package body for storing a chip and a lead electrically connected with the chip, wherein an oxide layer is formed on the surface of a part of the intermediate portion of the lead, the part of the intermediate portion being allowed to adhere to a plastic.

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