Heat-curing solvent-free one-component adhesives which are...

Details Heat-curing solvent-free one-component adhesives which are... Heat-curing solvent-free one-component adhesives which are...

C - Chemistry, Metallurgy

09

J

C09J 175/04 (2006.01) C08G 18/58 (2006.01) C08G 18/79 (2006.01) C08G 59/40 (2006.01) C09J 5/06 (2006.01)

Patent

CA 2210279

Disclosed is a heat-curing solvent-free one-pack composition comprising A) as a hardener component, a polyaddition product containing hydroxyl and uretdione groups, B) as a binder component, a 1,2-epoxide compound having more than one 1,2-epoxide group and one or more hydroxyl groups in the molecule, C) a catalyst for polymerizing epoxide groups, and D) optionally, a further hydroxyl-containing compound. The composition is useful as a polyurethane (PU) adhesive which does not give off an elimination product.

On divulgue une composition thermodurcissable monocomposée sans solvant comprenant : A) en tant que composant durcisseur, un produit de polyaddition contenant des groupes d'hydroxyles et d'uretdiones, B) en tant que composant liant, un composé 1,2-époxide contenant plus d'un groupe de 1,2-époxide et un ou plusieurs groupes d'hydroxyle par molécule, C) un catalyseur pour polymériser les groupes d'époxides et D) au choix, un autre composé contenant de l'hydroxyle. La composition est utile en tant qu'adhésif de polyuréthane (PU) ne dégageant pas de sous-produits.

Affiliated with

Also associated with

Rating

Heat-curing solvent-free one-component adhesives which are... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curing solvent-free one-component adhesives which are..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curing solvent-free one-component adhesives which are... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1704621